Liquid-cooled type heat dissipation structure

Abstract

This invention relates to a liquid-cooled heat dissipation structure, comprising at least one liquid-cooled heat dissipation module. The module includes multiple liquid-cooled heat dissipation elements for heat conduction in contact with an optical module, and at least one conduit unit. Each liquid-cooled heat dissipation element has an interface portion. The conduit unit includes a conduit and a pair of seals. Each end of the conduit has a connecting portion, and the pair of seals is disposed on each connecting portion. The conduit unit connects the interface portions via the connecting portions and seals, thereby connecting the liquid-cooled heat dissipation elements in series. This liquid-cooled heat dissipation module provides liquid cooling for the optical module.

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