Heat dissipation device

Abstract

The present application discloses a heat dissipation device, which comprises a heat-conducting mounting element and a heat dissipation mechanism. The heat-conducting mounting element is configured to mount a component to be cooled. The heat dissipation mechanism comprises a first heat dissipation element and a second heat dissipation element. Each of the first and second heat dissipation elements comprises a carrier member, a heat dissipation member, a magnetic member, and a magnetic pressing cover member. The carrier member is provided with an accommodation groove. The heat dissipation member is disposed within the accommodation groove, with a portion of the heat dissipation member protruding from the accommodation groove and abutting against the heat-conducting mounting element. The magnetic member is disposed within the heat dissipation member. The magnetic pressing cover member is arranged on the carrier member and positioned on a side of the heat dissipation member opposite to the heat-conducting mounting element. The magnetic pressing cover member acts magnetically on the magnetic member. The heat dissipation member of the present application is capable of continuously dissipating heat transferred from the component to be cooled.

Description

[Technical Field]

[0001] This application relates to the field of heat dissipation, specifically to a heat dissipation device. [Previous Technology]

[0002] Currently, traditional air-cooling methods are increasingly unable to meet the heat dissipation requirements of high-power communication equipment. Therefore, liquid cooling has become an important application direction in the field of communication equipment heat dissipation. Existing liquid cooling components are usually installed on one side of the communication equipment. However, because gaps easily form between the liquid cooling components and the optical module during use, the heat dissipation effect of the liquid cooling components is poor. [Summary of the Invention]

[0003] In view of the above situation, it is necessary to propose a heat dissipation device so that the heat dissipation component presses against the heat-conducting mounting element that is thermally compatible with the component to be dissipated during heat dissipation, thereby improving the heat dissipation effect.

[0004] This application provides a heat dissipation device, including a thermally conductive mounting element and a heat dissipation mechanism. The thermally conductive mounting element is used to mount a component to be cooled and thermally engages with the component. The heat dissipation mechanism includes a first heat dissipation element and a second heat dissipation element. The first heat dissipation element and the second heat dissipation element are detachably connected and inserted into the thermally conductive mounting element. Both the first heat dissipation element and the second heat dissipation element include a support member, a heat dissipation element, a magnetic element, and a magnetic cover. The support member is located on the side of the thermally conductive mounting element and has a receiving groove. The heat dissipation element is located in the receiving groove, and a portion of the heat dissipation element protrudes from the receiving groove into the thermally conductive mounting element for contacting the component to be cooled within the thermally conductive mounting element. The magnetic element is located within the heat dissipation element. The magnetic cover covers the opening of the receiving groove of the support member and is located on the side of the heat dissipation element away from the thermally conductive mounting element. The magnetic cover acts on the magnetic element by magnetic force, so that the magnetic element holds the heat dissipation element and presses the heat dissipation element against the component to be cooled within the thermally conductive mounting element.

[0005] In other embodiments, the heat dissipation mechanism further includes two connecting elements, a liquid inlet and a liquid outlet. The two connecting elements are respectively disposed on opposite sides of the two carriers and communicate with the receiving groove of each carrier. The liquid inlet and the liquid outlet are respectively communicated with the two connecting elements. The liquid introduced by the liquid inlet enters the receiving groove of the carrier through the connected connecting element, flows into the connecting element connected to the liquid outlet after passing through the heat dissipation component, and flows out from the liquid outlet.

[0006] In other embodiments, the connecting element includes a first connector and a second connector. The first connector is connected to the carrier of the first heat dissipation element, and the second connector is connected to the carrier of the second heat dissipation element. A receiving cavity is formed between the first connector and the second connector, which communicates with the receiving groove of the carrier. The liquid inlet and the liquid outlet are both connected to the first connector and communicate with the receiving cavity.

[0007] In other embodiments, the first connector includes a first connector body and a recessed portion. The first connector body is disposed on one side of the corresponding support member, and one end of the first connector body is connected to the support member. The recessed portion is recessed at the other end of the first connector body. The second connector includes a second connector body and a protruding portion. The second connector body is disposed on one side of the corresponding support member and is opposite to the first connector body. One end of the second connector body is connected to the support member. The protruding portion protrudes at the other end of the second connector body and is inserted into the recessed portion.

[0008] In other embodiments, the corresponding positions of the protrusion and the recess are provided with connecting holes, and the heat dissipation mechanism further includes a connecting pin, which is inserted into the connecting hole.

[0009] In other embodiments, the carrier is provided with a plurality of receiving grooves arranged side by side along a first direction, and the groove walls of two adjacent receiving grooves extending along a second direction perpendicular to the first direction are provided with connecting notches, and the plurality of connecting notches are arranged alternately.

[0010] In other embodiments, the heat sink includes a heat sink body and a plurality of fins. The heat sink body is disposed in the receiving groove, and a portion of the heat sink body protrudes from the receiving groove into the thermally conductive mounting element for contacting the component to be cooled within the thermally conductive mounting element. The heat sink body has a mounting groove, and the plurality of fins are spaced apart at the bottom of the mounting groove along the second direction.

[0011] In other embodiments, the heat sink further includes a mounting body, which is disposed on one side of the heat sink. The mounting body has a groove, and the magnetic element is disposed in the groove. The magnetic cover acts on the magnetic element by repulsive magnetic force so that the magnetic element abuts against the heat sink.

[0012] In other embodiments, the heat dissipation mechanism further includes a sealing member, which is disposed in the receiving groove and located between the carrier and the heat sink, for sealing the gap between the carrier and the heat sink.

[0013] In other embodiments, the sealing element includes a sealing body and a raised sealing portion. The sealing body is disposed between the receiving groove and the heat sink. The heat sink includes two adjacent surfaces opposite to the sealing body. The raised sealing portion protrudes from the surfaces of the sealing body and the heat sink.

[0014] By adopting the above technical solution, the component to be cooled is installed on the thermally conductive mounting element and thermally connected, and the first and second heat dissipation elements are detachably connected and inserted into the thermally conductive mounting element. The magnetic cover of the first and second heat dissipation elements can act on the magnetic component through magnetic force, so that the magnetic component holds the heat dissipation element and presses the heat dissipation element against the component to be cooled within the thermally conductive mounting element. In this way, the heat of the component to be cooled can be transferred to the heat dissipation element for heat dissipation. Since the heat dissipation element presses against the component to be cooled within the thermally conductive mounting element throughout the heat dissipation process, the heat dissipation element and the component to be cooled can be stably attached together without gaps. The heat dissipation element can continuously dissipate the heat transferred to the component to be cooled, resulting in better heat dissipation effect.

Implementation Method

[0015] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0016] Please refer to Figure 1. This application embodiment provides a heat dissipation device 100 for dissipating heat from an installed component (not shown) to reduce its temperature. Specifically, the heat dissipation device 100 includes a thermally conductive mounting element 10 and a heat dissipation mechanism 20.

[0017] Please refer to Figure 2. The thermally conductive mounting element 10 is used to mount the component to be cooled and to thermally engage with the component. The thermally conductive mounting element 10 includes two stacked thermally conductive mounting pieces 11. Each thermally conductive mounting piece 11 has four insertion holes 111 arranged side by side. Each insertion hole 111 can mount a component to be cooled. In this embodiment, the component to be cooled is an optical module, but it is not limited to this. It can be understood that optical modules are widely used in cloud computing, artificial intelligence, big data and other scenarios to support high-speed data transmission. The optical module is a core device in the optical fiber communication system. It consists of optoelectronic devices, functional circuits and optical interfaces, and is mainly used to realize the conversion of electrical-optical and optical-electrical signals. The transmitting end of the optical module converts the electrical signal into an optical signal. After transmission through optical fiber, the receiving end converts the optical signal back into an electrical signal.

[0018] Please refer to Figure 3 as well. The heat dissipation mechanism 20 includes a first heat dissipation element 21 and a second heat dissipation element 22. The first heat dissipation element 21 and the second heat dissipation element 22 are detachably connected and inserted into the heat-conducting mounting element 10. Both the first heat dissipation element 21 and the second heat dissipation element 22 include a support member 211, a heat dissipation element 212, a magnetic element 213, and a magnetic cover member 214. The support member 211 is located on the side of the heat-conducting mounting element 10 and has a receiving groove 2111. The heat dissipation element 212 is located in the receiving groove 2111, wherein part of the bottom of the receiving groove 2111 is through. The heat sink 212 can protrude from the through portion of the receiving groove 2111 into the heat-conducting mounting element 10 for contacting the heat-dissipating component inside the heat-conducting mounting element 10. The magnetic component 213 is disposed inside the heat sink 212. The magnetic cover 214 is disposed at the opening of the receiving groove 2111 of the support component 211 and is located on the side of the heat sink 212 away from the heat-conducting mounting element 10. The magnetic cover 214 acts on the magnetic component 213 by magnetic force, so that the magnetic component 213 holds the heat sink 212 and makes the heat sink 212 press against the heat-conducting mounting element 10 for the heat-dissipating component.

[0019] In the heat dissipation device 100 provided in this application embodiment, by installing the component to be dissipated on the thermally conductive mounting element 10 and performing thermally conductive cooperation, and by detachably connecting and inserting the first heat dissipation element 21 and the second heat dissipation element 22 into the thermally conductive mounting element 10, the magnetic cover 214 of the first heat dissipation element 21 and the second heat dissipation element 22 can act on the magnetic element 213 by magnetic force, so that the magnetic element 213 abuts against the heat dissipation element 212 and the heat dissipation element 212 presses against the component to be dissipated in the thermally conductive mounting element 10. In this way, the heat of the component to be dissipated can be transferred to the heat dissipation element 212 for heat dissipation. Since the heat dissipation element 212 presses against the component to be dissipated in the thermally conductive mounting element 10 throughout the process, the heat dissipation element 212 and the component to be dissipated can be stably attached together without gaps. The heat dissipation element 212 can continuously dissipate the heat transferred to the component to be dissipated, and the heat dissipation effect is better.

[0020] Please refer to Figure 4. In other embodiments, the heat dissipation mechanism 20 further includes two connecting elements 23, a liquid inlet 24, and a liquid outlet 25. The two connecting elements 23 are respectively disposed on opposite sides of the two support members 211 and communicate with the receiving groove 2111 of each support member 211. The liquid inlet 24 and the liquid outlet 25 are respectively communicated with the two connecting elements 23. The liquid introduced into the liquid inlet 24 enters the receiving groove 2111 of the support member 211 through the connected connecting element 23, flows into the connecting element 23 connected to the liquid outlet 25 after passing through the heat dissipation member 212, and flows out from the liquid outlet 25. In this embodiment, both the liquid inlet 24 and the liquid outlet 25 are tubular structures; the liquid introduced into the liquid inlet 24 can be water, but is not limited to this, as long as it is a liquid that can cool the heat dissipation component. Thus, by introducing liquid into the liquid inlet 24, the liquid first flows from the connecting element 23 connected to the liquid inlet 24 into the receiving groove 2111 of the carrier 211, then the liquid flows into the heat sink 212, then the liquid flows through the heat sink 2121 and then from the connecting element 23 connected to the liquid outlet 25 into the liquid outlet 25, and finally the liquid flows out from the liquid outlet 25. During the liquid flow process, it can carry away the heat transferred by the component to be cooled, and can cool the component to be cooled.

[0021] In other embodiments, the connecting element 23 includes a first connecting member 231 and a second connecting member 232. The first connecting member 231 is connected to the carrier member 211 of the first heat dissipation element 21, and the second connecting member 232 is connected to the carrier member 211 of the second heat dissipation element 22. A receiving cavity 233 communicating with the receiving groove 2111 of the carrier member 211 is formed between the first connecting member 231 and the second connecting member 232. The liquid inlet member 24 and the liquid outlet member 25 are both connected to the first connecting member 231 and communicate with the receiving cavity 233. Thus, by forming a receiving cavity 233 communicating with the receiving groove 2111 of the carrier member 211 between the first connecting member 231 and the second connecting member 232, the liquid introduced by the liquid inlet member 24 can flow into the carrier member 211 of the first heat dissipation element 21 and the carrier member 211 of the second heat dissipation element 22 through the receiving cavity 233, thereby dissipating heat from the heat dissipation component. In some embodiments, the first connector 231 and the corresponding carrier 211 are an integral structure, and the second connector 232 and the corresponding carrier 211 are an integral structure. In some embodiments, the first connector 231 and the corresponding carrier 211 are separate structures, and the second connector 232 and the corresponding carrier 211 are separate structures.

[0022] In other embodiments, the first connector 231 includes a first connector 2311 and a recess 2312. The first connector 2311 is a block structure. The first connector 2311 is disposed on one side of the corresponding support member 211, and one end of the first connector 2311 is connected to the support member 211. The recess 2312 is recessed at the other end of the first connector 2311. The second connector 232 includes a second connector 2321 and a protrusion 2322. The second connector 2321 is a block structure. The second connector 2321 is disposed on one side of the corresponding support member 211 and is disposed opposite to the first connector 2311. One end of the second connector 2321 is connected to the support member 211. The protrusion 2322 protrudes at the other end of the second connector 2321 and is inserted into the recess 2312. The receiving cavity 233 is formed between the first connector 2311 and the second connector 2321. In this embodiment, there are four recessed portions 2312 located around the first connector 2311, and four protruding portions 2322 located around the second connector 2321. The protruding portions 2322 are block-shaped and adapted to the shape of the recessed portions 2312. By providing the protruding portions 2322 and the recessed portions 2312, the first connector 2311 and the second connector 2321 can be engaged together, making the connection between the first connector 2311 and the second connector 2321 more stable.

[0023] In other embodiments, connecting holes 234 are provided at corresponding positions of the protrusions 2322 and the recesses 2312, and the heat dissipation mechanism 20 also includes connecting pins 26, which are inserted into the connecting holes 234. In this embodiment, connecting holes 234 are provided on each protrusion 2322 and the recesses 2312; there are two connecting pins 26, each inserted into two protrusions 2322 and two recesses 2312. By providing connecting holes 234 and connecting pins 26 and inserting the connecting pins 26 into the connecting holes 234, a fixed connection between the first connector 2311 and the second connector 2321 can be achieved; and the installation and removal of the connecting pins 26 are relatively convenient.

[0024] In other embodiments, the carrier 211 has a plurality of receiving grooves 2111 arranged side by side along the first direction, and a connecting notch 2112 is formed in the groove wall between two adjacent receiving grooves 2111 extending along a second direction perpendicular to the first direction. The plurality of connecting notches 2112 are staggered. In this embodiment, the first direction is the X-axis direction, the second direction is the Y-axis direction, there are four receiving grooves 2111, and the four receiving grooves 2111 have three connecting notches 2112 in total in the groove wall in the first direction. The three connecting notches 2112 are distributed in an S-shape. In this way, the liquid introduced by the liquid inlet 24 can flow into the plurality of receiving grooves 2111 sequentially through the receiving cavity 233, and the flow path is the longest, which can carry away more heat transferred by the component to be cooled, and the heat dissipation effect is better.

[0025] In other embodiments, the heat sink 212 includes a heat sink 2121 and a plurality of fins 2122. The heat sink 2121 is disposed in a receiving groove 2111, and a portion of the heat sink 2121 protrudes from the receiving groove 2111 into the thermally conductive mounting element 10 for contacting the component to be cooled within the thermally conductive mounting element 10. The heat sink 2121 has a mounting groove 2121C, and the plurality of fins 2122 are spaced apart along a second direction at the bottom of the mounting groove 2121C. By spaced apart the plurality of fins 2122 within the mounting groove 2121C of the heat sink 2121, liquid flowing into the mounting groove 2121C can sequentially flow through the plurality of fins 2122, thereby carrying away the heat transferred from the component to be cooled.

[0026] Please refer to Figures 5 and 6 together. In other embodiments, the heat sink 212 also includes a mounting body 2123. The mounting body 2123 is disposed on one side of the heat sink 2121. The mounting body 2123 has a groove 2123A. The magnetic element 213 is disposed in the groove 2123A. The magnetic cover 214 acts on the magnetic element 213 by repulsive magnetic force so that the magnetic element 213 abuts against the heat sink 212. In this embodiment, the mounting body 2123 is plate-shaped, and there are two mounting bodies 2123 located on opposite sides of the heat sink 2121. Each mounting body 2123 has two cylindrical grooves 2123A. The magnetic components 213 are magnets and are equal in number to the grooves 2123A. The upper part of the magnetic component 213 installed in the groove 2123A is the S pole and the lower part is the N pole. The lower part of the magnetic cover 214 covering the support 211 is the S pole and the upper part is the N pole. In this way, the magnetic cover 214 can act on the magnetic component 213 by repulsive magnetic force, so that the magnetic component 213 supports the heat sink 212. Furthermore, by setting the mounting body 2123, the installation and removal of the magnetic component 213 can be facilitated.

[0027] In other embodiments, the heat dissipation mechanism 20 further includes a sealing member 27, which is disposed within the receiving groove 2111 and located between the carrier member 211 and the heat sink 2121, for sealing the gap between the carrier member 211 and the heat sink 2121. In this embodiment, the sealing member 27 is annular and made of silicone. Thus, the sealing member 27 can block the gap between the carrier member 211 and the heat sink 2121, thereby preventing liquid from flowing from the heat sink 2121 into the thermally conductive mounting element 10.

[0028] Please refer to Figure 7. In other embodiments, the sealing element 27 includes a sealing body 271 and a raised sealing portion 272. The sealing body 271 is disposed between the receiving groove 2111 and the heat sink 2121. The heat sink 2121 includes two adjacent surfaces opposite to the sealing body 271. The raised sealing portion 272 protrudes from the surfaces of the sealing body 271 opposite to the heat sink 2121. Specifically, the heat sink 2121 has a T-shaped structure. The two adjacent surfaces of the heat sink 2121 opposite to the sealing body 271 are a first abutting surface 2121A and a second abutting surface 2121B. The first abutting surface 2121A and the second abutting surface 2121B are perpendicularly connected. A raised sealing portion 272 is provided on the side of the sealing body 271 opposite to the first abutting surface 2121A. Two raised sealing portions 272 are spaced apart on the side of the sealing body 271 opposite to the second abutting surface 2121B. The raised sealing portion 272 has an annular structure. By providing a raised sealing portion 272 on the surface of the sealing body 271 opposite to the heat sink 2121, the raised sealing portion 272 abuts against the heat sink 2121, thereby improving the sealing performance between the receiving groove 2111 and the heat sink 2121. This more effectively seals the gap between the receiving groove 2111 and the heat sink 2121, preventing liquid from flowing from the heat sink 2121 into the thermally conductive mounting element 10. In some embodiments, the sealing body 271 and the raised sealing portion 272 are an integral structure. In some embodiments, the sealing body 271 and the raised sealing portion 272 are separate structures.

[0029] The general usage process of the heat dissipation device 100 provided in this application embodiment is as follows:

[0030] A component to be cooled is installed in each insertion hole 111 of the thermally conductive mounting part 11 of the thermally conductive mounting element 10; then liquid is introduced into the liquid inlet 24. The liquid first flows from the connecting element 23 connected to the liquid inlet 24 into the receiving groove 2111 of the carrier 211, then the liquid flows into the heat sink 212, then the liquid flows through the heat sink 2121 and then flows from the connecting element 23 connected to the liquid outlet 25 into the liquid outlet 25, and finally the liquid flows out from the liquid outlet 25 and carries away the heat transferred by the component to be cooled.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application. [Simplified Explanation of the Diagram]

[0032] Figure 1 is a three-dimensional structural schematic diagram of the heat dissipation device provided in the embodiment of this application;

[0033] Figure 2 is an exploded structural diagram of the heat dissipation device shown in Figure 1;

[0034] Figure 3 is an exploded structural diagram of the heat dissipation device shown in Figure 2;

[0035] Figure 4 is an exploded structural diagram of the heat dissipation mechanism in the heat dissipation device shown in Figure 2;

[0036] Figure 5 is a schematic cross-sectional view of the heat dissipation device shown in Figure 1 along the AA direction;

[0037] Figure 6 is an enlarged view of the heat dissipation device shown in Figure 5 at point B;

[0038] Figure 7 is a three-dimensional structural schematic diagram of the seal shown in Figure 6.

Claims

1. A heat dissipation device, improved in that it includes a thermally conductive mounting element and a heat dissipation mechanism, wherein the thermally conductive mounting element is used to mount a component to be cooled and thermally engages with the component to be cooled; the heat dissipation mechanism includes a first heat dissipation element and a second heat dissipation element, the first heat dissipation element and the second heat dissipation element are detachably connected and inserted into the thermally conductive mounting element, each of the first heat dissipation element and the second heat dissipation element includes a support member, a heat dissipation element, a magnetic element and a magnetic cover member, the support member is disposed on the side of the thermally conductive mounting element and has a receiving groove, the heat dissipation element is disposed in the receiving groove, a portion of the heat dissipation element protrudes from the receiving groove into the thermally conductive mounting element for abutting against the component to be cooled within the thermally conductive mounting element, the magnetic element is disposed within the heat dissipation element, and the magnetic cover member covers the opening of the receiving groove of the support member and is located on the side of the heat dissipation element away from the thermally conductive mounting element, the magnetic cover member acts on the magnetic element by magnetic force, so that the magnetic element abuts against the heat dissipation element and the heat dissipation element presses against the component to be cooled within the thermally conductive mounting element.

2. The heat dissipation device as described in claim 1, wherein, The heat dissipation mechanism further includes two connecting elements, a liquid inlet, and a liquid outlet. The two connecting elements are respectively located on opposite sides of the two carriers and communicate with the receiving groove of each carrier. The liquid inlet and the liquid outlet are respectively connected to the two connecting elements. The liquid introduced through the liquid inlet enters the receiving groove of the carrier through the connecting element, flows through the heat dissipation component, flows into the connecting element connected to the liquid outlet, and flows out from the liquid outlet.

3. The heat dissipation device as described in claim 2, wherein, The connecting element includes a first connector and a second connector. The first connector is connected to the carrier of the first heat dissipation element, and the second connector is connected to the carrier of the second heat dissipation element. A receiving cavity is formed between the first connector and the second connector, which communicates with the receiving groove of the carrier. The liquid inlet and the liquid outlet are both connected to the first connector and communicate with the receiving cavity.

4. The heat dissipation device as described in claim 3, wherein, The first connector includes a first connector body and a recessed portion. The first connector body is disposed on one side of the corresponding support member, and one end of the first connector body is connected to the support member. The recessed portion is recessed at the other end of the first connector body. The second connector includes a second connector body and a protruding portion. The second connector body is disposed on one side of the corresponding support member and is opposite to the first connector body. One end of the second connector body is connected to the support member. The protruding portion protrudes at the other end of the second connector body and is inserted into the recessed portion.

5. The heat dissipation device as described in claim 4, wherein, The protruding part and the recessed part are provided with connecting holes at corresponding positions. The heat dissipation mechanism also includes a connecting pin, which is inserted into the connecting hole.

6. The heat dissipation device as described in claim 1, wherein, The support member has a plurality of receiving grooves arranged side by side along a first direction, and the groove walls of two adjacent receiving grooves extending along a second direction perpendicular to the first direction have a connecting notch, and the plurality of connecting notches are arranged alternately.

7. The heat dissipation device as described in claim 6, wherein, The heat sink includes a heat sink body and a plurality of fins. The heat sink body is disposed in the receiving groove, and a portion of the heat sink body protrudes from the receiving groove into the thermally conductive mounting element for contacting the component to be cooled within the thermally conductive mounting element. The heat sink body has a mounting groove, and the plurality of fins are spaced apart at the bottom of the mounting groove along the second direction.

8. The heat dissipation device as described in claim 7, wherein, The heat sink further includes a mounting body, which is disposed on one side of the heat sink. The mounting body has a groove, and the magnetic component is disposed in the groove. The magnetic cover acts on the magnetic component by means of repulsive magnetic force, so that the magnetic component holds the heat sink.

9. The heat dissipation device as described in claim 7, wherein, The heat dissipation mechanism further includes a sealing element, which is disposed in the receiving groove and located between the carrier and the heat sink, for sealing the gap between the carrier and the heat sink.

10. The heat dissipation device as described in claim 9, wherein, The sealing element includes a sealing body and a raised sealing portion. The sealing body is disposed between the receiving groove and the heat sink. The heat sink includes two adjacent surfaces opposite to the sealing body. The raised sealing portion protrudes from the surfaces of the sealing body and the heat sink.

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