Integrated chip and method of forming the same
TW202634917APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114112724
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-13
- Filing Date
- 2025-04-02
- Publication Date
- 2026-08-16
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Figure TWG2TA001072418_001 
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Figure TWG2TA001072418_003
Abstract
An integrated chip includes a write transistor arranged over an upper surface of a substrate, and a read transistor arranged over the write transistor. The write transistor includes a first channel region vertically extending in a first direction perpendicular to the upper surface of the substrate, a first gate region vertically extending in the first direction and arranged along the first channel region, and a first source / drain region and a second source / drain region respectively in contact with a top portion and a bottom portion of the first channel region. The read transistor includes a second channel region extending in a second direction in parallel with the upper surface and a second gate region extending in a third direction in parallel with the upper surface and perpendicular to the second direction. The second gate region is arranged under the second channel region and over the first channel region.
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