Semiconductor structure including an electrical pad and method of manufacturing the same

TW202634921APending Publication Date: 2026-08-16NAN YA TECH
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Patent Information

Application Number
TW114124939
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-11
Filing Date
2025-07-01
Publication Date
2026-08-16

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Abstract

A semiconductor structure and a method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a substrate, an upper structure, a vertical transistor and an electrical pad. The upper structure is disposed on the substrate. The vertical transistor is disposed in the upper structure. The electrical pad is disposed on the vertical transistor. A periphery portion of the electrical pad horizontally overlaps an upper portion of the vertical transistor.
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