Semiconductor device and method of forming the same

TW202634950APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114122977
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-25
Filing Date
2025-06-19
Publication Date
2026-08-16

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Abstract

A semiconductor structure and a method of fabricating the structure are disclosed. The method includes forming a superlattice structure with a nanostructured layer and a sacrificial nanostructured layer on a base structure on a substrate, forming a polysilicon structure on the superlattice structure, and forming a S / D region in the superlattice structure. A S / D portion of the S / D region extends above the nanostructured layer. The method further includes modifying a thickness of the S / D portion, depositing a dielectric layer on the modified S / D portion, and replacing the polysilicon structure and the sacrificial nanostructured layer with a gate structure.
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