Short channel mosfet devices with low turn-on voltage and their fabrication methods

TW202634981APending Publication Date: 2026-08-16重庆万国半导体科技有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114115977
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-11
Filing Date
2025-04-28
Publication Date
2026-08-16

Smart Images

  • Figure TWG2TA001072447_001
    Figure TWG2TA001072447_001
  • Figure TWG2TA001072447_002
    Figure TWG2TA001072447_002
  • Figure TWG2TA001072447_003
    Figure TWG2TA001072447_003
Patent Text Reader

Abstract

The present invention discloses a low turn-on voltage short channel MOSFET device and its manufacturing method, comprising: sequentially growing an epitaxial layer and a first oxide layer on a silicon wafer; Perform body region injection and source region injection on the upper part of the epitaxial layer; Etching to form gate trenches; Growing a gate oxide layer on the trench wall of the gate trench; Form gate polycrystalline silicon in the gate trench; Complete the subsequent production process. In the present invention, by first injecting into the body region and the source region, and then etching to form a gate trench, it is possible to avoid the situation where the source region is injected too deeply near the gate trench due to the over etching of polycrystalline silicon in the gate trench, resulting in a shorter conductive channel and channel leakage. This makes it possible to mass produce low turn-on voltage short channel MOSFET devices.
Need to check novelty before this filing date? Find Prior Art