Semiconductor device

TW202634994APending Publication Date: 2026-08-16AP MEMORY TECH CORP
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Patent Information

Application Number
TW115116682
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-06-11
Filing Date
2021-10-26
Publication Date
2026-08-16

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Abstract

A semiconductor device is provided. The semiconductor device includes a substrate portion, a wiring portion, a capacitor structure, and a plurality of capacitor electrode structures. The wiring portion is disposed over the substrate portion. The capacitor structure includes a bottom metal plate, a top metal plate, and a plurality of capacitor units. The top metal plate is disposed over the bottom metal plate. The capacitor units are disposed between the bottom metal plate and the top metal plate. The capacitor electrode structures are disposed over the bottom metal plate and the top metal plate and are coupled to either the bottom metal plate or the top metal plate of the capacitor structure. The capacitor electrode structures include a coplanar contacting surface.
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