Silicon-on-insulator substrate and its preparation method

TW202635011APending Publication Date: 2026-08-16XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
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Patent Information

Application Number
TW114150739
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-11-12
Filing Date
2025-12-23
Publication Date
2026-08-16

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Abstract

This invention provides a silicon-on-insulator substrate and a method for preparing the same. The method for preparing the silicon-on-insulator substrate includes: growing a polycrystalline silicon layer on the release surface of a current reusable donor substrate to form a support substrate; bonding the support substrate to a current donor substrate to be bonded via the polycrystalline silicon layer to form a current bonded sheet; and performing a release heat treatment on the current bonded sheet to obtain a silicon-on-insulator substrate and a reusable donor substrate; wherein the current reusable donor substrate is the remaining portion of the previous donor substrate to be bonded used to prepare the previous silicon-on-insulator substrate after the previous release heat treatment.
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