Silicon-on-insulator substrate and its preparation method
TW202635011APending Publication Date: 2026-08-16XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114150739
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-11-12
- Filing Date
- 2025-12-23
- Publication Date
- 2026-08-16
Smart Images

Figure TWG2TA001073301_001 
Figure TWG2TA001073301_002 
Figure TWG2TA001073301_003
Abstract
This invention provides a silicon-on-insulator substrate and a method for preparing the same. The method for preparing the silicon-on-insulator substrate includes: growing a polycrystalline silicon layer on the release surface of a current reusable donor substrate to form a support substrate; bonding the support substrate to a current donor substrate to be bonded via the polycrystalline silicon layer to form a current bonded sheet; and performing a release heat treatment on the current bonded sheet to obtain a silicon-on-insulator substrate and a reusable donor substrate; wherein the current reusable donor substrate is the remaining portion of the previous donor substrate to be bonded used to prepare the previous silicon-on-insulator substrate after the previous release heat treatment.
Need to check novelty before this filing date? Find Prior Art