Semiconductor device strucure with reduced keep-out-zone and methods of making the same
TW202635014APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114112509
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-12
- Filing Date
- 2025-04-01
- Publication Date
- 2026-08-16
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Abstract
µm, which may help shield the semiconductor devices in the first region from stress caused by the TSV. Accordingly, the TSV may not negatively affect performance of nearby semiconductor devices, and the TSV and the semiconductor devices may be located closer to one another (e.g., ＜
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