Integrated circuit device and method of fabricating the same

TW202635015APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114118438
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-26
Filing Date
2025-05-16
Publication Date
2026-08-16

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Abstract

An integrated circuit device includes a first cell including a first transistor; and a second cell abutting the first cell at a first cell boundary and including at least a portion of a second circuit. The first cell includes one or more pin layers at the first cell boundary, the one or more pin layers including a highest pin layer, the second circuit is connected to a gate of the first transistor by a first conductive path within the first cell, the first conductive path includes a first conductor in a top-most conductive layer among conductive layers forming the first conductive path within the first cell, the top-most conductive layer being a higher layer than the highest pin layer, and the second circuit includes a second conductor connected to the first conductive path at a first pin conductor in a first pin layer among the one or more pin layers.
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