Rhenium-cobalt alloy composition and process for effective metal electrodeposition in 3d-integration

TW202635045APending Publication Date: 2026-08-16MACDERMID ENTHONE INC
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Patent Information

Application Number
TW114146383
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-27
Filing Date
2025-11-27
Publication Date
2026-08-16

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Patent Text Reader

Abstract

A method of creating one or more metal interconnects in an electronic device, wherein the electronic device comprises one or more features within which the one or more metal interconnects are created, the method comprising the steps of (a) depositing a copper layer on the one or more features; (b) depositing a rhenium-cobalt alloy layer on the copper layer; and (c) depositing a tin or tin alloy layer on the rhenium-cobalt alloy layer; wherein the rhenium-cobalt alloy layer comprises greater than
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