Substrate processing apparatus, protective components, substrate processing methods, manufacturing methods and processes for semiconductor devices

Abstract

A technology is provided that allows for adjustment of the range used to suppress the adhesion of reaction byproducts and the like to the inner peripheral surface of a processing container. It comprises: a processing container for processing a substrate; a gas supply unit for supplying gas suitable for processing the substrate into the processing container; a protective member disposed along the inner peripheral surface of the processing container and whose height can be adjusted by rotating in a circumferential direction; and a control unit configured to control the gas supply and process the substrate after the height of the protective member is adjusted.

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