Methods of processing substrate and apparatus of processing substrate

Abstract

The present invention provides a substrate processing method, comprising: a first step of supplying a fluorine-containing gas to clean a chamber; a second step of simultaneously supplying a process gas and applying plasma to remove residual fluorine inside the chamber; and a third step of applying plasma after placing a substrate on a substrate support to process the substrate; wherein, in the second step, the spacing between the gas jet and the substrate support, the power of the plasma, or the pressure inside the chamber are set differently from those in the third step. none

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