Substrate processing method and substrate processing apparatus
TW202635065APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW114140806
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-05
- Filing Date
- 2025-10-22
- Publication Date
- 2026-08-16
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Abstract
[Problem] To improve the uniformity of etching a polycrystalline silicon film formed on a substrate. [Solution] A substrate processing method disclosed herein includes: a process of adding a silica compound to an alkaline processing solution to generate an etching solution, and a process of using the etching solution to etch a polycrystalline silicon film formed on a substrate.
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