Package structure and method of making the same
TW202635073APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114112725
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-11
- Filing Date
- 2025-04-02
- Publication Date
- 2026-08-16
Smart Images
Figure 00000000_0000_ABST
Abstract
A package structure includes a package substrate, a package module on the package substrate, a package lid including a package lid plate portion over the package module, and a package lid foot portion connected to the package lid plate portion and attached to the package substrate, and a fastening member located at a corner of the package module and configured to fasten the package lid plate portion to the package substrate.
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