Substrate processing device

Abstract

The substrate processing apparatus includes: a polishing section for polishing a substrate; a transport section for transporting the substrate before polishing to the polishing section; and a cleaning section for cleaning the polished substrate. The cleaning section has a first cleaning unit and a second cleaning unit arranged in two layers. Each of the first and second cleaning units has multiple cleaning modules arranged in a straight line. The transport section is disposed between the first and second cleaning units and has a sliding stage for transporting the substrate before polishing along the arrangement direction of the multiple cleaning modules.

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