Grinding method for substrate mounting stage and substrate mounting stage

Abstract

To suppress the generation of etching spots caused by the tilting of the machining tool due to the cutting load during the processing of the substrate mounting stage, a grinding method is provided, which grinds the substrate mounting surface on the substrate mounting stage. The substrate mounting stage has a substrate, a lower molten film disposed on the substrate, and an upper molten film disposed on an electrode layer. The method includes: an impregnation treatment of the molten film by applying an impregnating agent; a planarization treatment of the substrate mounting surface by grinding; and a roughening treatment of the central portion of the substrate mounting surface other than the periphery by using the periphery of the substrate mounting surface as a mask.

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