Manufacturing method of electronic device

Abstract

A manufacturing method of an electronic device includes: providing a substrate; performing a laser modification step on the substrate to form a plurality of modified regions; performing a first inspection step on the substrate by a first apparatus after the laser modification step, the first inspection step including providing a first light through the substrate to obtain a first phase difference and calculate a first stress value; performing a hole-forming step on the substrate to form a plurality of through-holes in the modified regions; and performing a second inspection step on the substrate by the first apparatus after the hole-forming step, the second inspection step including providing a second light through the substrate to obtain a second phase difference and calculate a second stress value. The substrate has a first temperature during the first inspection step, the substrate has a second temperature during the second inspection step, and the second temperature is different from the first temperature.

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