Substrate processing apparatus and measurement method

TW202635115APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114141388
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-29
Filing Date
2025-10-27
Publication Date
2026-08-16

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Abstract

[Problem] The present invention aims to determine the film thickness of a thin film located on the surface of a substrate using a simple configuration. [Solution] A substrate processing apparatus includes: a transport device, a measuring device, and a control unit. The transport device has a transport arm that holds and transports a substrate. The measuring device measures the film thickness of a thin film located on the surface of the substrate. The measuring device has: a housing having an opening through which the substrate held by the transport arm can pass; and a film thickness measuring device disposed in the housing for measuring the film thickness of the thin film on the substrate. The control unit controls the transport device, holding the substrate with the transport arm while moving the transport arm to allow the substrate to pass through the opening in the housing, and uses the film thickness measuring device to measure the film thickness.
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