Wafer-like sensor configured for sensor measurements in high-temperature environments and a process of implementing the same

Abstract

A wafer-like sensor includes at least one temperature sensor configured to obtain a temperature within the high temperature environment, a support substrate, a temperature circuit component arranged on the support substrate, an electrical interface arranged on the support substrate, at least one power interconnect arranged on the support substrate, at least one data interconnect arranged on the support substrate, and at least one sensor interconnect arranged on the support substrate. A process of implementing the wafer-like sensor is also disclosed.

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