Substrate processing apparatus and substrate processing method

TW202635126APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114148290
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-19
Filing Date
2025-12-10
Publication Date
2026-08-16

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Abstract

The purpose of this invention is to stably perform processing by irradiating the back side of a substrate with light. The substrate processing apparatus of this invention includes: a substrate holding section for holding the substrate in a processing chamber; an irradiation section comprising: a light source; a housing having an internally formed light source chamber that houses the light source and is separated from the processing chamber; and a window forming part of the housing for allowing light irradiated by the light source to pass through and be supplied to the back side of the substrate in the processing chamber for processing; a processing chamber-side gas supply section for supplying inert gas to the processing chamber; a processing chamber-side exhaust section for exhausting the inert gas from the processing chamber; a light source chamber-side gas supply section for supplying inert gas to the light source chamber; and a light source chamber-side exhaust section for exhausting the inert gas from the light source chamber.
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