Semiconductor device and methods of forming the same
TW202635138APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114119338
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-04
- Filing Date
- 2025-05-22
- Publication Date
- 2026-08-16
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Figure TWG2TA001072484_001 
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Figure TWG2TA001072484_003
Abstract
An adhesive bonding structure and methods for forming the same are provided. In some embodiments, a semiconductor device includes an interposer, and a plurality of dies attached to the interposer. In some embodiments, the plurality of dies includes at least one dummy die, and one semiconductor die. In some embodiments, the dummy die is attached to the top surface of the interposer by an adhesive layer. In some embodiments, the semiconductor device further includes a molding compound surrounding the plurality of dies.
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