Electronic device

Abstract

The present disclosure provides an electronic device, including a core layer, a first circuit structure, a second circuit structure, an electronic unit, and a connecting component. The core layer includes a conductive through via, an inlay portion, and a peripheral heat-dissipating portion surrounding the inlay portion, and has an upper surface and a lower surface opposite to each other. The conductive through via passes through the core layer and extends to the upper surface and the lower surface. The first circuit structure is disposed on the upper surface of the core layer and is electrically connected to the conductive through via. The second circuit structure is disposed on the lower surface of the core layer and is electrically connected to the conductive through via. The electronic unit is disposed on the first circuit structure and is electrically connected to the first circuit structure. The connecting component is disposed on the second circuit structure and is electrically connected to the second circuit structure.

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