Apparatus for joining substrates and methods therefor

TW202635165APending Publication Date: 2026-08-16ASML NETHERLANDS BV
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Patent Information

Application Number
TW114147233
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-11
Filing Date
2025-12-03
Publication Date
2026-08-16

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Abstract

A joining apparatus for joining a first substrate to a second substrate. The apparatus comprising a stage and a support structure. The stage is for holding the first substrate. The support structure for supporting the second substrate. The stage comprises a stage mark and an optical system for projecting an stage mark image.
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