Lead frame strip having molding buses and method of using the same to fabricate semiconductor packages

Abstract

A lead frame strip comprises a plurality of blocks. Each block of the plurality of blocks comprises a molding bus, a first plurality of rows, a first plurality of molding gates, a second plurality of rows, and a second plurality of molding gates. The first plurality of rows are on a first side of the molding bus. The second plurality of rows are on a second side of the molding bus. The second side is opposite to the first side. A method comprises the steps of providing a lead frame strip; mounting a plurality of transistors; attaching a plurality of metal clips or a plurality of bond wires; forming a molding encapsulation; applying a punching process; and applying a sawing process.

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