Die bonding device and die bonding method

Abstract

The present invention provides a die bonding device and a die bonding method capable of more precisely identifying the position of the die while maintaining the distance between the workbench and the bonding head. The die bonding device according to the present invention includes: a workbench supporting a substrate with a first die disposed thereon; a bonding head bonding a second die onto the first die; a gantry extending in the space between the bonding head and the workbench in a first horizontal direction; and a visual unit identifying the position of the first die and the second die while moving along the gantry in the first horizontal direction. The visual unit includes: a first camera set oriented toward the first horizontal direction to capture images; a second camera set oriented toward the first camera set to capture images; and an optical system configured between the first camera set and the second camera set to form a light path guiding the light reflected from the edge regions of the first die and the second die toward the first camera set and the second camera set.

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