Semiconductor package structure

Abstract

A semiconductor package structure includes a first semiconductor die, a second semiconductor die, and a conductive structure. The first semiconductor die includes a electrical component and an inductor disposed in a dielectric layer. The first semiconductor die also includes a semiconductor substrate disposed over the dielectric layer. The first semiconductor die also includes a first row of guarding-through vias extending through the semiconductor substrate and between the electrical component and the inductor. The second semiconductor die vertically overlaps the first row of through vias. The conductive structure is disposed over the first semiconductor die and electrically couples the second semiconductor die to the first row of guarding-through vias.

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