Package device

TW202635184APending Publication Date: 2026-08-16INNOLUX CORP
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Patent Information

Application Number
TW114136734
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-05
Filing Date
2025-09-24
Publication Date
2026-08-16

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    Figure TWG2TA001072628_001
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    Figure TWG2TA001072628_002
  • Figure TWG2TA001072628_003
    Figure TWG2TA001072628_003
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Abstract

A package device includes a substrate and a meatal structure. The substrate has a first region and a second region surrounding the first region. The metal structure is disposed on the substrate and includes a signal pattern and a shielding component. The shielding component includes a first shielding component and a second shielding component. The signal pattern and the first shielding component are disposed in the first region, while the second shielding component is disposed in the second region. The first shielding component and the second shielding component are isolated from each other. In a direction normal to the substrate, a dimension of the second shielding component gradually increases with distance away from an edge of the substrate.
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