Substrate architecture
TW202635186APending Publication Date: 2026-08-16PANELSEMI CORP
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Patent Information
- Application Number
- TW115101808
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-05-28
- Filing Date
- 2026-01-16
- Publication Date
- 2026-08-16
Smart Images
Figure TWG2TA001073380_001 
Figure TWG2TA001073380_002 
Figure TWG2TA001073380_003
Abstract
ppm / °C along a horizontal plane thereof and has a passage. The function chip unit is at least partially accommodated in the passage, with a gap derived between the function chip unit and the bridging substrate. The filling material is arranged in the gap. By controlling the CTE of the bridging substrate and integrating the function chip unit within the passage, the substrate architecture effectively addresses thermal stress issues and enhances structural integration.
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