Solder mask defined underfill material application control

TW202635190APending Publication Date: 2026-08-16BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC
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Patent Information

Application Number
TW114147262
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-04
Filing Date
2025-12-03
Publication Date
2026-08-16

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    Figure TWG2TA001073132_003
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Abstract

An electronic component includes a substrate having a surface; a solder mask on a portion of the surface of the substrate, the solder mask having at least one control feature defined by a gap between a first portion of the solder mask and a second portion of the solder mask; at least one electronic component having an edge spaced apart from the gap by a distance; and an underfill material located between the edge of the at least one electronic component and the at least one control feature, the gap being devoid of the underfill material.
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