Microneedle arrays, patches, and manufacturing methods of microneedle arrays
TW202635280APending Publication Date: 2026-09-01LINTEC CORP +1
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Patent Information
- Application Number
- TW115100396
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-15
- Filing Date
- 2026-01-06
- Publication Date
- 2026-09-01
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Abstract
A microneedle array 1 is disclosed, comprising a plurality of microneedles 11 for use as acupuncture needles in acupuncture treatment. The length of each microneedle 11 is 250 μm or more and 1500 μm or less. When a compressive load is applied to the tip of each microneedle 11 along its length, the tip strength of the microneedle 11, measured as the maximum stress generated by the microneedle 11, is 50 mN or more. This microneedle array 1 can achieve excellent acupuncture treatment effects.
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