Microneedle arrays, patches, and manufacturing methods of microneedle arrays

TW202635280APending Publication Date: 2026-09-01LINTEC CORP +1
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Patent Information

Application Number
TW115100396
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-15
Filing Date
2026-01-06
Publication Date
2026-09-01

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Abstract

A microneedle array 1 is disclosed, comprising a plurality of microneedles 11 for use as acupuncture needles in acupuncture treatment. The length of each microneedle 11 is 250 μm or more and 1500 μm or less. When a compressive load is applied to the tip of each microneedle 11 along its length, the tip strength of the microneedle 11, measured as the maximum stress generated by the microneedle 11, is 50 mN or more. This microneedle array 1 can achieve excellent acupuncture treatment effects.
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