Microneedle Adhesive Manufacturing Apparatus and Microneedle Adhesive Manufacturing Method

Abstract

The microneedle bonding apparatus (EA) is an apparatus for manufacturing a microneedle bonding assembly (UP) on which an adhesive piece (AS) is attached to a microneedle (MN) having multiple protrusions (MN1) on one side and a protective member (PM). The apparatus includes: a support mechanism (10) for supporting the protective member (PM) and the microneedle (MN) in a state where the protrusions (MN1) of the microneedle (MN) enter the opening (PM1) of the protective member (PM); and a patching mechanism (20) for attaching an adhesive piece (AS) larger than the microneedle (MN) to the other side of the protective member (PM) and the microneedle (MN) supported by the support mechanism (10) to form the microneedle bonding assembly (UP).

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