Flowhead

TW202635405APending Publication Date: 2026-09-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114112560
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-21
Filing Date
2025-04-01
Publication Date
2026-09-01

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    Figure TWG2TA001074142_003
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Abstract

The present disclosure is directed to respective embodiments of a flowhead including a gasket plate. A gasket positioned on the gasket plate. The gasket includes a first gasket portion of a first material, and a second gasket portion of a second material. The second gasket portion is coupled to the first gasket portion. A fluid hole extending through the gasket plate and into and through the first gasket portion. A fluid pathway is defined and delimited by the first gasket portion and the second gasket portion, and the fluid pathway extends into the second gasket portion to the first gasket portion. A fluid line is in fluid communication with the fluid hole, and the fluid line is configured, in operation, introduce one or more fluids into the fluid hole. The present disclosure is directed to methods of utilizing the flowhead.
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