Solder material, solder paste, foam solder, and solder joint

TW202635435APending Publication Date: 2026-09-01SENJU METAL IND CO LTD
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Patent Information

Application Number
TW114147561
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-05
Filing Date
2025-12-04
Publication Date
2026-09-01

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Abstract

An object of the present invention is to provide a solder material capable of suppressing non-wetting by improving the solder wetting rise performance on a core material during primary mounting. A solder material comprising: a core material having conductivity; and a solder layer present around the core material, wherein the solder material satisfies the following formula
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