Polishing pad and manufacturing method thereof
TW202635445APending Publication Date: 2026-09-01SK ENPULSE CO LTD
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Patent Information
- Application Number
- TW114140018
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-31
- Filing Date
- 2025-10-16
- Publication Date
- 2026-09-01
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Abstract
The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductor devices. Specifically, they relate to an environmentally friendly polishing pad as it comprises a sub pad layer comprising biomass, and to a process for preparing the same.
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