Polishing carrier head with electromagnetic pressure control
TW202635446APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114139038
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-12
- Filing Date
- 2025-10-09
- Publication Date
- 2026-09-01
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Figure TWG2TA001074352_001 
Figure TWG2TA001074352_002 
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Abstract
A carrier head for positioning a substrate on a polishing surface includes a housing, a support comprising multiple channels therethrough, and a plurality of pressure control elements secured within the multiple channels of the support. Each pressure control element includes an electromagnetic actuator, a first flexible membrane secured to the support such that portions of the first flexible membrane extending from each channel to define a balloon at each channel with each balloon defining a chamber such that actuation of the electromagnetic actuator adjusts a gas pressure in the respective chamber, and a pressure sensor arranged within the chamber.
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