An electropolishing head, conductive system, and assembly method for an electrochemical mechanical planarization device.

Abstract

This invention discloses an electropolishing head, a conductive system, and an assembly method for an electrochemical mechanical planarization device. The electropolishing head includes a conductive element that passes through a polishing head carrier for connecting to an external power supply unit; a conductive post that passes through the polishing head or the polishing head carrier and includes at least a shell, a telescopic element, and a conductive probe. The conductive probe and the shell are respectively connected to the telescopic element, allowing the conductive probe and the shell to slide relative to each other axially, and the outer wall of the conductive probe contacts and conducts electricity with the inner wall of the shell, forming a sliding contact conductive connection between the conductive probe and the shell; and a conductive post connecting unit disposed on the polishing head and detachably connected to the conductive post. This invention employs a sliding contact conductive device in a confined, enclosed space to tightly connect the conductive structures of two adjacent components, enabling efficient transmission of electrical energy between adjacent components.

Images