Dresser, method for manufacturing dresser, and method for manufacturing semiconductor device

Abstract

This invention provides a trimmer capable of forming a preferred film on the surface of a trimming protrusion, a method for manufacturing the trimmer, and a method for manufacturing a semiconductor device. According to one embodiment, the trimmer includes a first layer comprising a plate-like portion and a protrusion disposed on the plate-like portion. Furthermore, the trimmer includes a second layer comprising: a first region disposed on the protrusion and having a first film thickness; and a second region disposed on the protrusion and located relative to the first region on the upper end side of the protrusion, having a second film thickness greater than the first film thickness. In a cross-section including the upper end of the protrusion, the protrusion has a first surface located on one side of the upper end of the protrusion and a second surface located on the other side of the upper end of the protrusion. The second region is disposed on the upper end of the protrusion, the first surface, and the second surface.

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