Copper-clad laminate film, and article and device including the same

TW202635484APending Publication Date: 2026-09-01TORAY ADVANCED MATERIALS KOREA INC
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Patent Information

Application Number
TW114106981
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-25
Publication Date
2026-09-01

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Abstract

Disclosed are a copper-clad laminate film, and an article and a device which include the same. The copper-clad laminate film includes a non-conductive polymer substrate; a ternary alloy tie layer composed of Cu, Ni, and Ti, positioned on the non-conductive polymer substrate; and a copper layer positioned on the ternary alloy tie layer, wherein wherein the Ti content is in a range of
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