Curable resin materials, prepregs, resin films, metal-coated laminates, printed circuit boards, and semiconductor packages.
TW202635616APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information
- Application Number
- TW114148447
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-12
- Filing Date
- 2025-12-10
- Publication Date
- 2026-09-01
Abstract
A curable resin material comprising: a resin (A) comprising an indene ring, vinylbenzyl group and arylalkyl groups other than vinylbenzyl group; and a halogenated flame retardant (B). none
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