Method for manufacturing negative photosensitive resin composition and hardened embossed pattern

TW202635634APending Publication Date: 2026-09-01ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Application Number
TW114151838
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-24
Filing Date
2025-12-30
Publication Date
2026-09-01

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Abstract

The present invention aims to provide a negative photosensitive resin composition with high in-plane uniformity and excellent resolution of the film; and to provide a method for manufacturing a hardened embossed pattern using the negative photosensitive resin composition, a method for manufacturing polyimide, a polyimide curing product, a method for manufacturing the polyimide curing product, and a semiconductor device. The present invention provides a negative photosensitive resin composition containing (A) (A1) polyimide or (A2) polyimide precursor, (B) a photopolymerization initiator, and (C) a compound represented by the following general formula (1): {wherein, R1 represents an alkyl group having 1 to 10 carbon atoms}.
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