Conductive paste composition and electronic devices

Abstract

This invention provides a conductive paste composition in which the inorganic particles are well dispersed, exhibiting excellent storage stability and suppressing the formation of pores or pinholes during firing. The organic components also exhibit good dispersion, resulting in excellent electrode adhesion and superior blister resistance. Furthermore, this invention provides an electronic device manufactured using this conductive paste composition. This invention relates to a conductive paste composition comprising (meth)acrylic resin (A), inorganic particles (B), and solvent (C). The (meth)acrylic resin (A) has a weight-average molecular weight (Mw) of 20,000 to 600,000 and contains 50% by weight or more of alkyl methacrylate segments derived from ester substituents having alkyl branched structures, and 5% by weight or more to 40% by weight of (meth)acrylic acrylate segments derived from ester substituents having polyalkylene oxide groups with chain length distributions. The ratio of peak molecular weight (XP) to molecular weight dispersion width (ML) (XP / ML) of the polyalkylene oxide group evaluated by LC-MS is 0.5 to 1.5. The inorganic particles (B) comprise conductive particles with an average particle size of 0.01 μm to 10 μm. The solvent (C) is an organic solvent with a boiling point of 200°C to 250°C. none