Polyhydroxy resins, epoxy resins and their components, and cured products

Abstract

The present invention aims to provide a compound with excellent solvent solubility, heat resistance, thermal decomposition stability, thermal conductivity, and flame retardancy, as well as a curable resin composition containing the compound. The epoxy resin containing n=1, expressed by the following general formula (1), has an area percentage of 50% or more as determined by gel permeation chromatography. In formula (1), R1 independently represents a hydrogen atom, a fluorine atom, an alkoxy group, or a monovalent hydrocarbon group having 1 to 6 carbon atoms. R2 to R4 each independently represent a hydrogen atom, a fluorine atom, an alkoxy group, a monovalent hydrocarbon group having 1 to 6 carbon atoms, or a glycidyl ether group. n represents a number from 1 to 5.

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