Hardener compositions, single-component adhesives, semiconductor sealing materials, adhesives for semiconductor packaging and camera modules

TW202635768APending Publication Date: 2026-09-01ASAHI KASEI KOGYO KABUSHIKI KAISHA

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Patent Information

Application Number: TW115102734
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-02-03
Filing Date: 2026-01-23
Publication Date: 2026-09-01

Application Information

Patent Timeline

03 Feb 2025

Priority

23 Jan 2026

Application

TW115102734

01 Sep 2026

Publication

TW202635768A

IPC: C08G59/50; C08F2/50; C08G59/18; C08K3/014; C09J163/10; C09K3/10

Inventors: 前田貴紀

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Abstract

The present invention relates to a curing agent composition comprising an amine compound (a) and an olefin compound (b) which is liquid at 25°C, and whose total calorific value in the range of 25–200°C is less than 100 J / g in differential scanning calorimetry (DSC) at a heating rate of 10°C / min.

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