Sinterable bonding material and semiconductor device using the same

TW202635794APending Publication Date: 2026-09-01HENKEL KGAA

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Patent Information

Application Number: TW114142762
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2024-11-05
Filing Date: 2025-11-04
Publication Date: 2026-09-01

Application Information

Patent Timeline

05 Nov 2024

Priority

04 Nov 2025

Application

TW114142762

01 Sep 2026

Publication

TW202635794A

IPC: C08K3/08; C08L63/00; C09J9/02; C09J11/04; C09J163/00; H01B1/22; H01R4/04

Inventors: 王靜忠; 姚偉

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Abstract

This invention relates to a sinterable bonding material for adhering electronic components, the sintered product, the semiconductive device and the use thereof. In particular, the present invention relates to a cost-effective sinterable bonding material that provides high reliability after aging tests, robust adhesion at both ambient and elevated temperatures, and superior electrical conductivity for bonding electronic components, especially micro-size chips in the LED industry.

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