Photosensitive resin composition, conductive adhesive, method for manufacturing patterned substrate, electronic device and method for manufacturing the same.

TW202635795APending Publication Date: 2026-09-01TORAY INDUSTRIES INC
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Patent Information

Application Number
TW115104933
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-11-04
Filing Date
2026-02-09
Publication Date
2026-09-01

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Abstract

This invention provides a photosensitive resin composition that can reduce connection resistance even in fine patterns. The photosensitive resin composition comprises metal particles (A) containing a metal with a Young's modulus less than 70 GPa, an alkali-soluble resin (B), and a photosensitizer (C), wherein the median particle size of the metal particles (A) is less than 500 nm.
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