resin composition

Abstract

The objective of this invention is to provide: a resin composition that provides a hardened material with a low coefficient of linear thermal expansion and suppresses peeling (delamination) caused by the destruction of the hardened material; a method for manufacturing the resin composition; a resin sheet comprising the resin composition; a circuit board comprising the hardened material of the resin composition; and a semiconductor device comprising the circuit board. The present invention provides a resin composition comprising (A) an epoxy resin, (B) an active ester resin containing free radical polymerizable groups, and (C) a resin containing amide bonds, wherein (A) comprises (A-1) a liquid epoxy resin having a viscosity of 100 mPa·s or more at 25°C, and (C) comprises at least one of (C-1) a maleimide resin and (C-2) a polyamide resin, wherein the total mass percentage of (C-1) and (C-2) is 6% or more and 20% or less relative to 100% by mass of the resin composition.