Hardening components

Abstract

The present invention aims to provide a curable composition that exhibits excellent adhesion strength to metals such as copper, superior electrical properties (low relative permittivity, low dielectric tangent, etc.), excellent moisture resistance, and also possesses mechanical properties and insulation. This curable composition is applicable to electronic components such as sealants, extension films, or underfills in semiconductor devices. Furthermore, it possesses excellent processability and permeability into narrow crevices. The solution is a curable composition comprising an epoxy resin, a curing agent, and silicon oxide particles. The epoxy resin comprises bisphenol C type epoxy resin or triisocyanate type epoxy resin, and the silicon oxide particles account for 40% or more of the total volume.