Sealing resin composition and electronic component device
TW202635811APending Publication Date: 2026-09-01RESONAC CORP
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114151419
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-27
- Filing Date
- 2025-12-26
- Publication Date
- 2026-09-01
Abstract
The sealing resin composition includes an epoxy resin, a phenolic curing agent, a curing accelerator, an ester compound having three or more phenolic hydroxyl groups, and an inorganic filler.
Need to check novelty before this filing date? Find Prior Art