Polishing slurry, method of manufacturing semiconductor device, and micelle of branched polymers

TW202635830APending Publication Date: 2026-09-01SAMSUNG ELECTRONICS CO LTD +1
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Patent Information

Application Number
TW115105680
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-18
Filing Date
2026-02-12
Publication Date
2026-09-01

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Abstract

Disclosed are a polishing slurry and a method of manufacturing a semiconductor device, the polishing slurry that includes: a branched polymer including a hydrophobic unit, a micelle of the branched polymers, or a combination thereof, and a dispersion medium.
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